Products
Automatic Lapping and polishing machine/Lapping equipment (medium size)
Automatic Lapping and polishing machine/Lapping equipment (medium size)
Product Info
Automatic Lapping and polishing machine/Lapping equipment (medium size)
Feature:
-
100% independent development
-
Available for timer setting and time up alarm warring set up.
-
Available for Setting the grinding rings as 3 different mode(Moving Together, Moving Alternately, Moving Alone)
-
Available for Setting up the Pause Time and No. of Times when grinding rings move to Forward/Backward position.
-
Adjustable Grinding Plate Rotating Speed
-
Max. Grinding Size: 150*400mm
-
Able to grind 4 pieces (120*240mm plate) at the same time
Fine Cause CO.,LTD developed the "Wet Grinding Machine" to
apply wafer-grinding process in the printing steel plates grind work.
Welcome to all clients inquiry about OEM business!
Now, we produces thousands of the the pad printing steel plates in every month!
Videos
-
FC Thin Cliche Plate
FC Thin Cliche Plate
-
Laser Engraving Cliche Plate (thick)
Laser Engraving Cliche Plate (thick)
-
Fine Cause Prints Your Life
Fine Cause Prints Your Life
-
Magnetic Toolbox-(Magnetic Containers)
Magnetic Toolbox-(Magnetic Containers)
-
Pad printer Clean Ink Cup tutorial
Pad printer Clean Ink Cup tutorial
Downloads
-
The Relationship Between Pad Printing Plate Etching Depth and Printing
The Relationship Between Pad Printing Plate Etching Depth and Printing
-
SKD11 Material and Heat Treatment
SKD11 Material and Heat Treatment
-
How to Select the Silicone Pad Printing Pads?
How to Select the Silicone Pad Printing Pads?
-
Pad printing technology
Pad printing technology
-
How to Select Pad-Print and Screen-Print
How to Select Pad-Print and Screen-Print
-
Pad printer machine scraping ink is not clean, problem resolve
Pad printer machine scraping ink is not clean, problem resolve
RFQ form
Thank you for your query, Our specialist will contact you soon.